Topics Map > SCS CORES > HTSF (High Throughput Screening Facility)
HTSF - Plate Sealer
A guide to using the Plate Sealer apparatus
- Check if the air release valve of the air compressor is closed. If not, rotate the valve to the closed position (fully parallel to the ground).
- Power on the air pump (red switch outward). There will be loud noise when the pump is running.
- After pump stops, turn pressure regulator (black knob) clockwise until at least 120 PSI is reached.
- Turn on power of plate sealer on the back. If the sealer beeps showing "low air", adjust the air compressor pressure a bit higher until the sealer stops beeping.
- Wait when sealer heats, until the screen shows “seal”. Default condition is 145 degrees C, 3.5 sec, which can be changed in “setting”. If you changed it, make sure to change it back to default condition when finished sealing.
- When “seal” appears on screen, place plate on the carrier. The direction does not matter, but make sure it located inside the metal rims. Very important, otherwise the plate could be crushed.
- Push “seal” on the screen and the plate will be taken inside and sealed. The air compressor will pump every a few plates, be prepared for the noise.
- Take out the plate and spread it until it cools down before stacking. It is important NOT to stack the plates prematurely, especially if compound libraries are used, where a hot seal can heat the bottom of the plate sitting above it.
- Turn sealer off. Turn pump off (red switch). If the sealer will not be used any further for the day, continue with steps 10-12 after steps 9.
- Adjust PSI to 0 (black knob counter-clockwise), turn pump off (red switch).
- Pull metal ring near pressure display to release air. There will be a very loud noise.
- Release residual air by opening the air release valve (refer to step 1, now the valve should be perpendicular to the ground), and tilt the air compressor to drain residual condensed water.
